Connectivity

Rogers Develops Laminate for High-Power Circuit Applications

By Photo of Jeffrey Hill

[Satellite TODAY 12-20-10] Rogers Corp. introduced its RT/duroid 6035HTC high-thermal-conductivity laminate material engineered for low loss in high-power circuits, the developer announced Dec. 17.
    The composite material is designed for RF and microwave applications in military and high-reliability applications required to handle high power levels, such as power amplifiers.
    Rogers RT/duroid 6035HTC laminates incorporate a unique filler material that aims to achieve superior heat-transfer characteristics compared to other high frequency circuit materials with similar dielectric constant.

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