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VITES Taps EnSilica for Terminal Upgrades

By Mark Holmes | October 31, 2023

      A rendering of VITES system, which mounts onto a car roof like a standard radio fin. Photo: VITES

      EnSilica is to partner with VITES to supply its new beam-former chip for satellite user terminals. The two companies announced the collaboration on Oct. 30. VITES will use the chip at the heart of its new ViSAT-Ka-band terminal. EnSilica’s beam-forming chip is optimized to enable VITES’s creation of power- and cost-efficient ground-based flat panel user terminals for satellite communication systems that can be used across a range of fixed and satcom on-the-move applications.

      VITES, a German-based company, specializes in broadband wireless systems for professional applications and has been delivering flat panel terminals based on its own phased array technology since 2019. Its new ViSAT-Ka-band terminal is intended to be integrated into vehicles for communications-on-the move applications. It is able to track the movement of LEO and other NGSO satellites and allows users to access high-speed connectivity anywhere on the planet while the vehicle is moving.

      “For the upcoming NGSO-constellations, quantum leap solutions are required in order to drive performance up, while driving cost and power consumption down. Our new ViSAT-Ka-band terminals are the solution to these challenges. We’re delighted to be partnering with EnSilica and working closely with them on leading SOTM solutions that are delivering broadband connectivity even when there is no access to terrestrial networks,” Martin Gassner, CEO of VITES, said in a statement.