Kythrion module photo by Circuits Integrated Hellas

Circuits Integrated Hellas (CIH) has launched a new chipset platform ‘Kythrion’ as it looks to provide a more efficient platform for Earth Observation (EO) data. The platform is currently undergoing packaging and stress validation, with early-stage demonstrators expected in late third quarter of 2025 and general availability in the second quarter of 2026. The company announced the launch, May 19.

Kythrion is an integrated solution that combines transmit, receive, and antenna functionality within a proprietary 3D antenna-in-package (AiP) and system-in-package (SiP) architecture. By vertically stacking compound III-V semiconductors like gallium arsenide (GaAs) and gallium nitride (GaN) with silicon technologies, Kythrion aims to deliver an over 60 percent reduction in antenna size, weight, power and cost (SWaP-C), while increasing thermal performance — without the need to overhaul existing manufacturing infrastructure.

The company believes that Kythrion can address the limitations of legacy flat panel phased array antennas, which they say often account for up to 20%vof satellite payload mass and introduce design trade-offs in size, cost, and power. It says that by eliminating unnecessary PCB layers and consolidating RF, logic, and antenna elements in a dense 3D chip, Kythrion will enable satcom operators to do more with less — fitting more advanced sensors on EO platforms, including LEO satellites, extending mission lifetimes, and reducing launch costs.

“There is nothing else like Kythrion on the market today. It’s a true game-changer — engineered to improve FPA performance; to fundamentally reshape how satcom platforms are designed, deployed, and scaled; and to contribute to environmental change efforts by enabling better, more consistent capture and analysis of EO data,” Paolo Fioravanti, Co-founder and CEO, said in a statement.