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Comtech Wins In-Flight Connectivity SSPA Order

By | June 29, 2016
      Lufthansa Boeing 747

      A Boeing 747-8 Photo: Boeing

      [Via Satellite 06-29-2016] Comtech Xicom Technology has received an $11.8 million follow-on production order for Solid-State Power Amplifiers (SSPAs) to be used in an airborne, In-Flight Connectivity (IFC) application. The Gallium Nitride (GaN) SSPAs will enable high-speed satellite connectivity for airlines based in the Americas, Europe, and Asia.

      “Comtech continues to increase its presence in this market and we look forward to a long period of growth as we transition to higher-volume production to meet the worldwide demand for continuous connectivity,” said Stanton Sloane, president and CEO of Comtech Telecommunications.