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Comtech Xicom Technology Receives $3.4 Million Order for SSPA for IFC

By | January 11, 2016
      Wi-Fi Airplane IFC

      Photo: Santi Díaz

      [Via Satellite 01-11-2016] Comtech Xicom Technology has received an order for $3.4 million for Solid-State Power Amplifiers (SSPAs) to be used in an airborne, In-Flight Connectivity (IFC) application. This order is a follow-on production award in this growing commercial airborne market.

      “Connectivity is fundamental to modern life. New technologies continue to drive the communications landscape and passengers are demanding improved connectivity while flying,” said Stanton Sloane, president and chief executive officer at Comtech Telecommunications. “Comtech has developed industry-leading airborne amplifier technology to deliver superior high-speed communication services to the traveling public.”