Engineering Forum: Payload Innovation – What Architectures and Technologies Will Enhance the Next Big Satellite Service Marketplace?
Date of Event:
March 10th, 2014
15:15 - 16:30
The communications payload of a satellite is the business end of the space segment. We have evolved through the basic bent-pipe transponder to multi-beam antenna systems with on-board processors, and now to high-throughput satellites capable of over 100 Gbps of raw capacity. But, how will new payloads expand markets and integrate with the rest of the global information infrastructure? Are there necessary innovations on the payload side, and what technologies will make these a reality? Our panel of technology executives will consider these questions and provide some of their insights into payload capabilities yet to arrive on orbit.
Payload Product Line Manager
Chief Technology Officer and Senior Vice President of Technology & Innovation
Krishnan (Raj) Raghavan
Sr. Program Director, Advanced Payloads Business Development
Director, Design Center